THERMAL PASTE CPU AKASA 3.5gr

FeaturesAn evolution in silicone technology delivers outstanding thermal performance.Pro-grade Silicone technology provides a stable thermal compound which delivers a great thermal performance. Minimised resistance and maximised efficiency truly enables you to get a lot more from your cooler. RoHS compliant.  Specifications- Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT – Maximum thermal conductivity, 3.3W/mK – Electrically non-conductive – Form: Non-curing – Specific gravity: 3.5 – Operating temperature: -45°C to 200°C – Thermal resistance: 0.16cm²C/W @60um BLT – Volume: 3.5g