This product is widely used in PCB, BGA, CSP and other packaging, soldering, repair areas. All raw materials are finest, no halogen and Lead-free, the activity is good, and performance is stable. It can be used in precision soldering. The solvent added to the paste is organic and resin. The viscosity is moderate, the rheology is good. Specifications appearance and colour: transparency liquid odour: slightly pungent smell PH value: 4-5 flammability: non combustible density (g/cm³): 0.77-0.795 boiling point: 235-255 °C melting point: 130-150 °C decomposition temperature: does not decompose easily solubility: insoluble in water weight: 10 g
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- Phone: +30 2102203404
- Email: info@epirotikielectronics.gr
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